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"Analysis of Microchannel Heat Dissipation Characteristics of LTCC ..."

Yong Yang, Xuanjun Dai, Qionglian Wei (2019)

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DOI: 10.1145/3378065.3378115

access: closed

type: Conference or Workshop Paper

metadata version: 2021-11-03

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  dblp key:
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Yong Yang, Xuanjun Dai, Qionglian Wei:
Analysis of Microchannel Heat Dissipation Characteristics of LTCC Microwave Module. ICIIP 2019: 254-259

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