"Back-end 3D integration of HfO2-based RRAMs for low-voltage advanced IC ..."

Elisa Vianello et al. (2013)

> Home

Details and statistics

DOI: 10.1109/ICICDT.2013.6563344

access: closed

type: Conference or Workshop Paper

metadata version: 2021-05-11

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/icicdt/VianelloTHOCTDO13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icicdt/VianelloTHOCTDO13
Elisa Vianello, Olivier Thomas, M. Harrand, Santhosh Onkaraiah, T. Cabout, Boubacar Traore, T. Diokh, Houcine Oucheikh, Luca Perniola, Gabriel Molas, Philippe Blaise, J.-F. Nodin, Eric Jalaguier, Barbara De Salvo:
Back-end 3D integration of HfO2-based RRAMs for low-voltage advanced IC digital design. ICICDT 2013: 235-238

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.