"Smart Stacking™ and Smart Cut™ technologies for wafer level 3D ..."

Mariam Sadaka et al. (2013)

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DOI: 10.1109/ICICDT.2013.6563343

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Mariam Sadaka, Ionut Radu, Chrystelle Lagahe-Blanchard, Léa Di Cioccio:
Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration. ICICDT 2013: 231-234

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