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"3-Dimensional Integration with High Interconnection Density."

Rino Choi, Ye-Eun Hong, Anh Duy Nguyen (2022)

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DOI: 10.1109/ICICDT56182.2022.9933124

access: closed

type: Conference or Workshop Paper

metadata version: 2022-11-16

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  dblp key:
  - conf/icicdt/ChoiHN22
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Rino Choi, Ye-Eun Hong, Anh Duy Nguyen:
3-Dimensional Integration with High Interconnection Density. ICICDT 2022: 77-80

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