BibTeX record conf/iccel/KimCS15

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@inproceedings{DBLP:conf/iccel/KimCS15,
  author    = {Youngil Kim and
               Seungdo Choi and
               Yong Ho Song},
  title     = {Skewed vertical interleaving scheme to improve data reliability in
               die-stacked {DRAM}},
  booktitle = {{IEEE} International Conference on Consumer Electronics, {ICCE} 2015,
               Las Vegas, NV, USA, January 9-12, 2015},
  pages     = {398--401},
  publisher = {{IEEE}},
  year      = {2015},
  url       = {https://doi.org/10.1109/ICCE.2015.7066461},
  doi       = {10.1109/ICCE.2015.7066461},
  timestamp = {Wed, 16 Oct 2019 14:14:51 +0200},
  biburl    = {https://dblp.org/rec/conf/iccel/KimCS15.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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