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ORCID"Fast 3-D thermal analysis of complex interconnect structures using ..."
Chuan Xu et al. (2009)
- Chuan Xu, Lijun Jiang, Seshadri K. Kolluri, Barry J. Rubin, Alina Deutsch, Howard H. Smith, Kaustav Banerjee:
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies. ICCAD 2009: 658-665
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