"Layout Based 3D Thermal Simulations of Integrated Circuits Components."

Krzysztof Slusarczyk, Marek Kaminski, Andrzej Napieralski (2004)

Details and statistics

DOI: 10.1007/978-3-540-25944-2_133

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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