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"Known void size micro-bump, a novel standard of 3D X-ray computed ..."
Lay Wai Kong, Osborne A. Martin (2018)
- Lay Wai Kong, Osborne A. Martin:
Known void size micro-bump, a novel standard of 3D X-ray computed tomography in-line metrology for accuracy assessment and monitoring. I2MTC 2018: 1-5
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