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"Industry's First 7.2 Gbps 512GB DDR5 Module."

Sung Joo Park et al. (2021)

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DOI: 10.1109/HCS52781.2021.9567190

access: closed

type: Conference or Workshop Paper

metadata version: 2023-01-12

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  dblp key:
  - conf/hotchips/ParkKJLKKNCYKJL21
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  persistent URL:
  - https://dblp.org/rec/conf/hotchips/ParkKJLKKNCYKJL21
Sung Joo Park, Jonghoon J. Kim, Kun Joo, Young-Ho Lee, Kyoungsun Kim, Young-Tae Kim, Woo-Jin Na, IkJoon Choi, Hye-Seung Yu, Wonyoung Kim, Ju-Yeon Jung, Jaejun Lee, Dohyung Kim, Young-Uk Chang, Gong-Heum Han, Hangi-Jung, Sunwon Kang, Jeonghyeon Cho, Hoyoung Song, Tae-Young Oh, Young-Soo Sohn, SangJoon Hwang, Jooyoung Lee:
Industry's First 7.2 Gbps 512GB DDR5 Module. HCS 2021: 1-11

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