Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Effect of TSV fabrication technology on power distribution in 3D ICs."

Suhas M. Satheesh, Emre Salman (2013)

> Home

Details and statistics

DOI: 10.1145/2483028.2483111

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/glvlsi/SatheeshS13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/glvlsi/SatheeshS13
Suhas M. Satheesh, Emre Salman:
Effect of TSV fabrication technology on power distribution in 3D ICs. ACM Great Lakes Symposium on VLSI 2013: 287-292

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.