"Thermal aware cell-based full-chip electromigration reliability analysis."

Syed M. Alam, Donald E. Troxel, Carl V. Thompson (2005)

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DOI: 10.1145/1057661.1057670

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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Syed M. Alam, Donald E. Troxel, Carl V. Thompson:
Thermal aware cell-based full-chip electromigration reliability analysis. ACM Great Lakes Symposium on VLSI 2005: 26-31

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