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ORCID"Thermal aware cell-based full-chip electromigration reliability analysis."
Syed M. Alam, Donald E. Troxel, Carl V. Thompson (2005)
- Syed M. Alam, Donald E. Troxel, Carl V. Thompson:
Thermal aware cell-based full-chip electromigration reliability analysis. ACM Great Lakes Symposium on VLSI 2005: 26-31
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