"Proposal of a Haptics and LSTM Based Soldering Motion Analysis System."

Kyohei Toyoshima et al. (2021)

Details and statistics

DOI: 10.1109/GCCE53005.2021.9621916

access: closed

type: Conference or Workshop Paper

metadata version: 2021-12-03

a service of  Schloss Dagstuhl - Leibniz Center for Informatics