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"Do Moldable Applications Perform Better on Failure-Prone HPC Platforms?"

Valentin Le Fèvre et al. (2018)

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DOI: 10.1007/978-3-030-10549-5_61

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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  - conf/europar/FevreBBHHRD18
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Valentin Le Fèvre, George Bosilca, Aurélien Bouteiller, Thomas Hérault, Atsushi Hori, Yves Robert, Jack J. Dongarra:
Do Moldable Applications Perform Better on Failure-Prone HPC Platforms? Euro-Par Workshops 2018: 787-799

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