"Performance impact of through-silicon vias (TSVs) in three-dimensional ..."

Jente B. Kuang et al. (2013)

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DOI: 10.1109/ESSCIRC.2013.6649162

access: closed

type: Conference or Workshop Paper

metadata version: 2021-07-23

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Jente B. Kuang, Keith A. Jenkins, Kevin Stawiasz, Jeremy D. Schaub:
Performance impact of through-silicon vias (TSVs) in three-dimensional technology measured by SRAM ring oscillators. ESSCIRC 2013: 419-422

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