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"Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging."

Florian Merget et al. (2021)

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DOI: 10.1109/ECOC52684.2021.9605906

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-31

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  dblp key:
  - conf/ecoc/MergetASSHWW21
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  - https://dblp.org/rec/conf/ecoc/MergetASSHWW21
Florian Merget, Manuel Ackermann, Bin Shen, Gordon Davis Saunders, Sebastian Haag, Michael Wolz, Jeremy Witzens:
Glass Molded Optical Interposers for Wafer Scale Datacom Component Packaging. ECOC 2021: 1-4

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