"3D/ 2.5D stacked IC cost modeling and test flow selection."

Said Hamdioui (2014)

Details and statistics

DOI: 10.1109/DTIS.2014.6850677

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-22

a service of  Schloss Dagstuhl - Leibniz Center for Informatics