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"Thermal Effect of TSVs in 3D Die-Stacked Integrated Circuits."
Hadrien A. Clarke, Kazuaki J. Murakami (2011)
- Hadrien A. Clarke, Kazuaki J. Murakami:
Thermal Effect of TSVs in 3D Die-Stacked Integrated Circuits. DSD 2011: 503-508
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