"Optimal number and placement of Through Silicon Vias in 3D Network-on-Chip."

Thomas Canhao Xu, Pasi Liljeberg, Hannu Tenhunen (2011)

Details and statistics

DOI: 10.1109/DDECS.2011.5783057

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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