"Modeling and analysis of cracked through silicon via (TSV) interconnections."

Vasileios Gerakis et al. (2014)

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DOI: 10.1109/DDECS.2014.6868817

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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  - https://dblp.org/rec/conf/ddecs/GerakisALH14
Vasileios Gerakis, Christina Avdikou, Alexandros Liolios, Alkis A. Hatzopoulos:
Modeling and analysis of cracked through silicon via (TSV) interconnections. DDECS 2014: 310-313

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