"Thermal-aware TSV repair for electromigration in 3D ICs."

Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty (2016)

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DOI: —

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type: Conference or Workshop Paper

metadata version: 2021-08-09

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Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty:
Thermal-aware TSV repair for electromigration in 3D ICs. DATE 2016: 1291-1296

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