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"Package and Chip Accelerated Aging Methods for Power MOSFET Reliability ..."

Ting-You Lin et al. (2019)

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DOI: 10.23919/DATE.2019.8714895

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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Ting-You Lin, Chauchin Su, Chung-Chih Hung, Karuna Nidhi, Chily Tu, Shao-Chang Huang:
Package and Chip Accelerated Aging Methods for Power MOSFET Reliability Evaluation. DATE 2019: 1661-1666

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