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"Assembly-Related Chip/Package Co-Design of Heterogeneous Systems ..."

Robert Fischbach, Tilman Horst, Jens Lienig (2019)

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DOI: 10.23919/DATE.2019.8714884

access: closed

type: Conference or Workshop Paper

metadata version: 2019-05-20

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Robert Fischbach, Tilman Horst, Jens Lienig:
Assembly-Related Chip/Package Co-Design of Heterogeneous Systems Manufactured by Micro-Transfer Printing. DATE 2019: 956-959

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