"A Boundary-Element Approach to Transient simulation of Three-Dimensional ..."

David D. Ling, S. Kim, J. White (1992)

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type: Conference or Workshop Paper

metadata version: 2017-03-16

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David D. Ling, S. Kim, J. White:
A Boundary-Element Approach to Transient simulation of Three-Dimensional Integrated Circuit Interconnect. DAC 1992: 93-98

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