"Copper interconnect technology for the 32 nm node and beyond."

Jeff Gambino, Fen Chen, John He (2009)

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DOI: 10.1109/CICC.2009.5280904

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Jeff Gambino, Fen Chen, John He:
Copper interconnect technology for the 32 nm node and beyond. CICC 2009: 141-148

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