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"Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste."

Yongfang Hu et al. (2023)

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DOI: 10.3233/FAIA231236

access: closed

type: Conference or Workshop Paper

metadata version: 2024-01-31

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  dblp key:
  - conf/cecnet/HuYWWSWZHHH23
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  - https://dblp.org/rec/conf/cecnet/HuYWWSWZHHH23
Yongfang Hu, Kun Yan, Ziyuan Wang, Liuwei Wang, Yipeng Sun, Yuefei Wang, Xinlong Zhang, Zongjie Han, Qingan Huang, Lei Han:
Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste. CECNet 2023: 542-548

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