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"Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write ..."

Jacob Dawes, Tzu-Hsuan Chou, Matthew L. Johnston (2023)

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DOI: 10.1109/BIOCAS58349.2023.10388923

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-08

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  dblp key:
  - conf/biocas/DawesCJ23
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  - https://dblp.org/rec/conf/biocas/DawesCJ23
Jacob Dawes, Tzu-Hsuan Chou, Matthew L. Johnston:
Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects. BioCAS 2023: 1-5

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