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"Data Mining Approaches for Packaging Yield Prediction in the ..."

Seung Hwan Park et al. (2013)

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DOI: 10.1109/BIGDATA.CONGRESS.2013.55

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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  dblp key:
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Seung Hwan Park, Cheong-Sool Park, Jun-Seok Kim, Sung-Shick Kim, Jun-Geol Baek, Daewoong An:
Data Mining Approaches for Packaging Yield Prediction in the Post-fabrication Process. BigData Congress 2013: 363-368

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