"Heuristic Approach for Identification of Random TSV Defects in 3D IC ..."

Tanusree Kaibartta, G. P. Biswas, Debesh K. Das (2020)

> Home

Details and statistics

DOI: 10.1109/ATS49688.2020.9301580

access: closed

type: Conference or Workshop Paper

metadata version: 2021-01-15

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/ats/KaibarttaBD20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/ats/KaibarttaBD20
Tanusree Kaibartta, G. P. Biswas, Debesh K. Das:
Heuristic Approach for Identification of Random TSV Defects in 3D IC During Pre-bond Testing. ATS 2020: 1-6

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.