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"A QDI Interconnect for 3D Systems Using Industry Standard EDA and Cell ..."

Matheus Trevisan Moreira et al. (2023)

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DOI: 10.1109/ASYNC58294.2023.10239556

access: closed

type: Conference or Workshop Paper

metadata version: 2024-04-01

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  dblp key:
  - conf/async/MoreiraKWSB23
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  - https://dblp.org/rec/conf/async/MoreiraKWSB23
Matheus Trevisan Moreira, William Koven, Tony F. Wu, Huseyin Ekin Sumbul, Edith Beigné:
A QDI Interconnect for 3D Systems Using Industry Standard EDA and Cell Libraries. ASYNC 2023: 58-59

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