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"LEGO: Empowering Chip-Level Functionality Plug-and-Play for ..."

Chong Zhang et al. (2023)

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DOI: 10.1145/3582016.3582050

access: closed

type: Conference or Workshop Paper

metadata version: 2023-08-20

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Chong Zhang, Songfan Li, Yihang Song, Qianhe Meng, Minghua Chen, Yanxu Bai, Li Lu, Hongzi Zhu:
LEGO: Empowering Chip-Level Functionality Plug-and-Play for Next-Generation IoT Devices. ASPLOS (3) 2023: 404-418

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