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"Signal integrity modeling and measurement of TSV in 3D IC."

Joohee Kim, Joungho Kim (2013)

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DOI: 10.1109/ASPDAC.2013.6509551

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Joohee Kim, Joungho Kim:
Signal integrity modeling and measurement of TSV in 3D IC. ASP-DAC 2013: 13-16

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