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"Stacking signal TSV for thermal dissipation in global routing for 3D IC."

Po-Yang Hsu, Hsien-Te Chen, TingTing Hwang (2013)

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DOI: 10.1109/ASPDAC.2013.6509682

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Po-Yang Hsu, Hsien-Te Chen, TingTing Hwang:
Stacking signal TSV for thermal dissipation in global routing for 3D IC. ASP-DAC 2013: 699-704

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