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"Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal ..."

Hong-Wen Chiou et al. (2023)

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DOI: 10.1145/3566097.3567911

access: closed

type: Conference or Workshop Paper

metadata version: 2023-02-27

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  dblp key:
  - conf/aspdac/ChiouJCLP23
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  persistent URL:
  - https://dblp.org/rec/conf/aspdac/ChiouJCLP23
Hong-Wen Chiou, Jia-Hao Jiang, Yu-Teng Chang, Yu-Min Lee, Chi-Wen Pan:
Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration. ASP-DAC 2023: 7-12

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