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"A 2D Clock Interconnect Electromigration-Thermal Coupling Simulation ..."

Hongchao Zhang, Yunfan Zuo (2023)

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DOI: 10.1109/ASICON58565.2023.10396460

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-16

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Hongchao Zhang, Yunfan Zuo:
A 2D Clock Interconnect Electromigration-Thermal Coupling Simulation Method Based on COMSOL. ASICON 2023: 1-4

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