BibTeX record conf/asicon/LiuWYYM17

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@inproceedings{DBLP:conf/asicon/LiuWYYM17,
  author    = {Jingyu Liu and
               Yongyong Wang and
               Xunyong Yang and
               Fashun Yang and
               Kui Ma},
  editor    = {Yajie Qin and
               Zhiliang Hong and
               Ting{-}Ao Tang},
  title     = {Analytical model of internal heat transfer of a power chip with through
               silicon via},
  booktitle = {12th {IEEE} International Conference on ASIC, {ASICON} 2017, Guiyang,
               China, October 25-28, 2017},
  pages     = {588--591},
  publisher = {{IEEE}},
  year      = {2017},
  url       = {https://doi.org/10.1109/ASICON.2017.8252544},
  doi       = {10.1109/ASICON.2017.8252544},
  timestamp = {Wed, 16 Oct 2019 14:14:56 +0200},
  biburl    = {https://dblp.org/rec/conf/asicon/LiuWYYM17.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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