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"Development of a 3-layer mechanism passive-type assistive suit for lower ..."

Chi Lok Wan et al. (2022)

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DOI: 10.1109/AIM52237.2022.9863371

access: closed

type: Conference or Workshop Paper

metadata version: 2022-08-30

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  dblp key:
  - conf/aimech/WanIKOKT22
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Chi Lok Wan, Toshifumi Ishioka, Chiaki Kanda, Keisuke Osawa, Kenji Kodama, Eiichiro Tanaka:
Development of a 3-layer mechanism passive-type assistive suit for lower back and upper arm. AIM 2022: 1237-1242

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