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"A Built-in Self-Test Scheme for TSVs of Logic-DRAM Stacked 3D ICs."

Wei-Hsuan Yang et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058898

access: closed

type: Conference or Workshop Paper

metadata version: 2023-10-17

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  dblp key:
  - conf/3dic/YangLHSH19
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  - https://dblp.org/rec/conf/3dic/YangLHSH19
Wei-Hsuan Yang, Jin-Fu Li, Chun-Lung Hsu, Chi-Tien Sun, Shih-Hsu Huang:
A Built-in Self-Test Scheme for TSVs of Logic-DRAM Stacked 3D ICs. 3DIC 2019: 1-3

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