"Modeling of substrate contacts in TSV-based 3D ICs."

Masayuki Watanabe et al. (2014)

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DOI: 10.1109/3DIC.2014.7152178

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - https://dblp.org/rec/conf/3dic/WatanabeFINKKK14
Masayuki Watanabe, Masa-Aki Fukase, Masashi Imai, Nanako Niioka, Tetsuya Kobayashi, Rosely Karel, Atsushi Kurokawa:
Modeling of substrate contacts in TSV-based 3D ICs. 3DIC 2014: 1-4

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