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"Thermo-mechanical study of a 2.5D passive silicon interposer technology: ..."

Benjamin Vianne et al. (2013)

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DOI: 10.1109/3DIC.2013.6702332

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/3dic/VianneBFPCGFCEHT13
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  - https://dblp.org/rec/conf/3dic/VianneBFPCGFCEHT13
Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stephanie Escoubas, Nicolas Hotellier, Olivier Thomas:
Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. 3DIC 2013: 1-7

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