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"A route towards production-worthy 5 µm × 25 µm and 1 ..."

Weng Hong Teh et al. (2009)

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DOI: 10.1109/3DIC.2009.5306562

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/3dic/TehCQAOGMSMCWMGD09
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  - https://dblp.org/rec/conf/3dic/TehCQAOGMSMCWMGD09
Weng Hong Teh, Raymond Caramto, Jamal Qureshi, Sitaram Arkalgud, M. O'Brien, T. Gilday, Kou Maekawa, T. Saito, Kouichi Maruyama, Thenappan Chidambaram, Wei Wang, David Marx, David Grant, Russ Dudley:
A route towards production-worthy 5 µm × 25 µm and 1 µm × 20 µm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration. 3DIC 2009: 1-5

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