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"Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding ..."

Takahiro Nagata et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058775

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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  - conf/3dic/NagataTNUKCH19
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  - https://dblp.org/rec/conf/3dic/NagataTNUKCH19
Takahiro Nagata, Kazumichi Tsumura, Kenro Nakamura, Kengo Uchida, Jin Kawakita, Toyohiro Chikyow, Kazuyuki Higashi:
Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process. 3DIC 2019: 1-4

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