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"Development of wafer thinning and dicing technology for thin wafer."

Chuichi Miyazaki et al. (2009)

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DOI: 10.1109/3DIC.2009.5306548

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - conf/3dic/MiyazakiSUA09
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  - https://dblp.org/rec/conf/3dic/MiyazakiSUA09
Chuichi Miyazaki, Haruo Shimamoto, Toshihide Uematsu, Yoshiyuki Abe:
Development of wafer thinning and dicing technology for thin wafer. 3DIC 2009: 1-4

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