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"Impact of containment and deposition method on sub-micron chip-to-wafer ..."

Sebastien Mermoz et al. (2011)

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DOI: 10.1109/3DIC.2012.6262953

access: closed

type: Conference or Workshop Paper

metadata version: 2022-05-18

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Sebastien Mermoz, Loic Sanchez, Léa Di Cioccio, Jean Berthier, Emilie Deloffre, Christian Fretigny:
Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield. 3DIC 2011: 1-5

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