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"Thermal resistance measurements of interconnections for a ..."

Keiji Matsumoto et al. (2009)

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DOI: 10.1109/3DIC.2009.5306546

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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Keiji Matsumoto, Soichiro Ibaraki, Katsuyuki Sakuma, Fumiaki Yamada:
Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack. 3DIC 2009: 1-5

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