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"Integration of intra chip stack fluidic cooling using thin-layer solder ..."

Yassir Madhour et al. (2013)

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DOI: 10.1109/3DIC.2013.6702343

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - https://dblp.org/rec/conf/3dic/MadhourZSBLTM13
Yassir Madhour, Michael Zervas, Gerd Schlottig, Thomas Brunschwiler, Yusuf Leblebici, John Richard Thome, Bruno Michel:
Integration of intra chip stack fluidic cooling using thin-layer solder bonding. 3DIC 2013: 1-8

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