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"Selection of underfill material in Cu hybrid bonding and its effect on the ..."

Dau Fatt Lim, K. C. Leong, Chuan Seng Tan (2011)

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DOI: 10.1109/3DIC.2012.6262981

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-31

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Dau Fatt Lim, K. C. Leong, Chuan Seng Tan:
Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone. 3DIC 2011: 1-4

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