Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"The influence of device morphology on wafer-level bonding with ..."

Hao-Wen Liang et al. (2016)

> Home

Details and statistics

DOI: 10.1109/3DIC.2016.7970009

access: closed

type: Conference or Workshop Paper

metadata version: 2017-07-13

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/LiangCLLYC16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/LiangCLLYC16
Hao-Wen Liang, Hsiu-Chi Chen, Chien-Hung Lin, Chia-Lin Lee, Shan-Chun Yang, Kuan-Neng Chen:
The influence of device morphology on wafer-level bonding with polymer-coated layer. 3DIC 2016: 1-4

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.