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"Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs ..."
H. Y. Li et al. (2011)
- H. Y. Li, L. Xie, L. G. Ong, A. Baram, I. Herer, Arnon Hirshberg, S. C. Chong, D. L. Kwong:
Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs application. 3DIC 2011: 1-4
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