"Which interconnects for which 3D applications? Status and perspectives."

Yann Lamy et al. (2013)

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DOI: 10.1109/3DIC.2013.6702344

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-31

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Yann Lamy, Jean-Philippe Colonna, G. Simon, Patrick Leduc, Séverine Cheramy, C. Laviron:
Which interconnects for which 3D applications? Status and perspectives. 3DIC 2013: 1-6

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