"Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid ..."

Cheng-Ta Ko et al. (2011)

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DOI: 10.1109/3DIC.2012.6262949

access: closed

type: Conference or Workshop Paper

metadata version: 2017-09-16

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Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen:
Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. 3DIC 2011: 1-4

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